Supply of deposition equipment for low-temperature metallic via filling
Original notice title
France – Microelectronic machinery and apparatus – Fourniture d’un équipement de dépôt dédié au remplissage métallique de vias à basse température
Opportunity Score
Why this score?
Opportunity
50 / 100
Complexity
70 / 100
Risk factors
Negotiated procedure with call for competition; likely limits number of candidates to a minimum of 3. No further negoti...
Full procurement documents (technical specifications, contract terms) not analyzed. Award criteria only partially known.
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Overview
Moderate opportunityKey Facts
- Supplies contract
- 1 lot
- Duration 12 MONTH
- Supply of a deposition equipment for low-temperature metallic via filling for memory applications.
- Equipment must handle 300mm wafers.
Show full summary
This tender by CEA Grenoble seeks a deposition equipment for low-temperature metallic via filling for memory applications in its clean room. The equipment must handle 300mm wafers and deposit tungsten thin films with high conformity in high aspect ratio vias. The contract includes one mandatory option (maintenance level 1 training) and four optional options (heat exchangers, power transformer, advanced maintenance training, warranty extension). The procedure is a negotiated procedure with call for competition, EU-funded under FAMES Pilot Line. No estimated value is disclosed. Submission is electronic via www.marchespublics.gouv.fr by 31 July 2026, 14:00 CEST. Award criteria are price-based but not exclusively; full criteria are in procurement documents.
Risks
Negotiated procedure with call for competition; likely limits number of candidates to a minimum of 3. No further negoti...
Full procurement documents (technical specifications, contract terms) not analyzed. Award criteria only partially known.
Analysis may be incomplete
Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.
Key Requirements
Technical
- Equipment must be capable of low-temperature metallic via filling (tungsten) for memory applications.
- Must support 300mm wafers.
- High conformity deposition in vias with high aspect ratio.
Requirements may be incomplete.
Award Criteria
Lot 1
Buyer
Name
Location
Grenoble, FRA
Website
Buyer profile
Identifier
77568501900298
Activity
Education
Lots (1)
LOT-0001
Supply of deposition equipment for low-temperature metallic via filling
Acquisition of a dedicated deposition equipment for low-temperature metallic via filling for memory applications, capable of 300mm wafers, tungsten thin film deposition with high conformity in high aspect ratio vias. Includes mandatory and optional options as described.
Location
Duration
Category
Award Criteria
Deadline
Award details
Le prix n'est pas le seul critère d'attribution et tous les critères sont énoncés uniquement dans les documents du marché.
Value note
Show original TED data
Original lot title
Fourniture d’un équipement de dépôt dédié au remplissage métallique de vias à basse température
Original TED description
Pour ses activités de recherche, qui visent à développer les technologies FDSOI 10nm et au-delà, le CEA-Leti souhaite faire l’acquisition d’un équipement dédié au remplissage métallique de vias à basse température, pour des applications mémoire, pour sa salle-blanche. L’équipement sera capable d’utiliser des wafers de 300mm et est prévu pour la déposition de film fin de tungstène à haute conformité dans des via avec un facteur de forme élevé. Le marché envisagé comprend une option à chiffrage obligatoire et quatre options à chiffrage facultatif : - Option avec chiffrage obligatoire : . Option 3 (prestation optionnelle) : Formation à la maintenance niveau 1. - Options avec chiffrage facultatif : . Option 1 (fourniture optionnelle) : Échangeurs de chaleurs / refroidisseurs. . Option 2 (fourniture optionnelle) : Transformateur d’alimentation électrique. . Option 4 (prestation optionnelle) : Formation à la maintenance avancée, tel que décrit au paragraphe 9 du cahier des charges. . Option 5 (prestation optionnelle) : Extension de garantie d'un an.
Procurement Details
- Publication date
- 30 Jun 2026
- Languages
- French, English
Reference metadata
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 452081-2026
Documents (1)
Similar tenders
Spain – Microelectronic machinery and apparatus – Suministro e instalación de un equipo de litografía óptica de proyección en el ultravioleta profundo, destinado al Instituto de Microelectrónica de Barcelona de la Agencia Estatal Consejo Superior de Investigaciones Científicas.
France – Microelectronic machinery and apparatus – Acquisition d’une paillasse de gravure matériaux III-V pour le CEA de GRENOBLE
Opportunity Score
Why this score?
Opportunity
50 / 100
Complexity
70 / 100
Risk factors
Negotiated procedure with call for competition; likely limits number of candidates to a minimum of 3. No further negoti...
Full procurement documents (technical specifications, contract terms) not analyzed. Award criteria only partially known.
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications