System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Original notice title
Germany – Miscellaneous special-purpose machinery – System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Opportunity Score
Why this score?
Opportunity
55 / 100
Complexity
65 / 100
Risk factors
No estimated value or budget disclosed. May affect feasibility of bidding.
Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Tender facts
- Contracting authority
- Fraunhofer-Gesellschaft - Einkauf B12
- Country
- Germany
- CPV
- 42990000 - Miscellaneous special-purpose machinery
- Deadline
- Jul 15, 2026
Overview
Moderate opportunityKey Facts
- Supplies contract
- 1 lot
- Duration 23 MONTH
- Supply of 1 fully automated plasma etch system for 300 mm wafers (mainframe and process chambers).
- System capable of high aspect ratio etching of silicon, SiO2, and SiN.
Show full summary
Tender for a fully automated high aspect ratio plasma etch system for 300 mm wafers, to be delivered to Dresden, Germany. One lot. Negotiated procedure with call for competition. EU funded. Estimated value not disclosed. Deadline: 2026-07-15 09:30 (local time). Procurement documents available but not analyzed.
Risks
No estimated value or budget disclosed. May affect feasibility of bidding.
Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...
Analysis may be incomplete
Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.
Key Requirements
Technical
- System must be fully automated for plasma etching on 300 mm wafers.
- Must achieve high aspect ratio patterning in silicon and related materials.
Certifications
- Compliance with cleanroom class 1000 (ISO 6) environment.
Requirements may be incomplete.
Award Criteria
Lot 1
Buyer
Location
München, DEU
Website
Buyer profile
Identifier
DE 129515865
Activity
General public services
Lots (1)
LOT-0000
System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Supply of 1 unit of a fully automated plasma etch system for 300 mm wafers used for high aspect ratio etching of silicon and related materials (SiO2, SiN) in a cleanroom class 1000 environment. Includes optional items per technical specification. Duration: 23 months.
Location
Duration
Category
Award Criteria
Deadline
Award details
Technische Ausführung
Verbindliche Lieferzeit
Preis
Value note
Show original TED data
Original TED description
1 Piece: System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) A fully automated process tool to be used for plasma etch processes on wafers with a diameter of 300 mm. The systems will be used for the processing of Silicon CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. The new tool shall be used for patterning of high aspect ratio features in silicon as well as all related needed materials (e.g. SiO2, SiN) to reach this main target. Optional items according to Technical Tender Specification.
Procurement Details
- Publication date
- 10 Jun 2026
- Languages
- German
Reference metadata
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 399697-2026
Documents (2)
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Opportunity Score
Why this score?
Opportunity
55 / 100
Complexity
65 / 100
Risk factors
No estimated value or budget disclosed. May affect feasibility of bidding.
Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications