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Denmark – Machines and apparatus for testing and measuring – One Photonic Wafer Probe Station and one Photonic Assembly Station

Danmarks Tekniske Universitet - DTU·Kgs. Lyngby, Denmark·EUR 1.3M·Deadline Nov 02, 2026 · 27 days left·Open·Supplies
High value
0/100

Opportunity Score

High riskLow complexity
SuppliesOpen
Why this score?

Opportunity

0 / 100

Complexity

0 / 100

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Tender facts

Contracting authority
Danmarks Tekniske Universitet - DTU
Country
Denmark
CPV
38540000 - Machines and apparatus for testing and measuring +3 more
Deadline
Nov 02, 2026
Estimated value
EUR 1.3M

AI tender analysis

Tenderwize prepares an AI analysis of this tender based on the TED notice and procurement documents: scope of work, key requirements, eligibility criteria, risks and questions for the buyer. The analysis is generated when the tender is opened.

Award Criteria

Lot 1

Price — 30%Machine (incl. physical requirements) — 15%Process — 40%Installation, service and guarantee — 15%

Lot 2

Price — 30%Machine (incl. physical requirements) — 15%Process — 40%Installation, service and guarantee — 15%

Buyer

Location

Kgs. Lyngby, DNK

Website

www.dtu.dk

Buyer profile

Open profile

Identifier

30060946

Activity

Education

Lots (2)

LOT-0001

One Photonic Wafer Probe Station (Lot 1)

The tender concerns a photonic wafer probe station to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers but the equipment should be possible to be configured also for edge coupling. In this case, different holders and fibers may be needed. The electrical characterstics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards.

SuppliesEU fundedElectronic submissionSME suitable

EUR 1.3M

Estimated value

Location

Kongens Lyngby, Denmark

Duration

Dec 2026

Category

Machines

Award Criteria

Price

LOT-0002

One Photonic Assembly Station (Lot 2)

The tender is for buying an optical assembly station for connecting fiber array units (FAUs) to an optical chip. The type of connection will be edge coupling using waveguides loops for alignment but if, necessary, the alignment can also be performed either using the light source on the chip (if it exists) or by using an external light source and connecting two FAUs, one on each side of the chip.

SuppliesEU fundedElectronic submissionSME suitable

EUR 1.3M

Estimated value

Location

Kongens Lyngby, Denmark

Duration

Dec 2026

Category

Machines

Award Criteria

Price

Procurement Details

Publication date
04 Oct 2026
Languages
English

Reference metadata

Legal basis
32014L0024

Reference IDs

Tender ID
681487-2026

Documents (1)

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