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System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

Fraunhofer-Gesellschaft - Einkauf B12·München, Germany·Expired · Jul 15, 2026·Neg W Call·Supplies
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Germany – Miscellaneous special-purpose machinery – System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

55/100

Ocena szansy

Needs reviewMedium complexity
SuppliesExpired
Skąd ta ocena?

Szansa

55 / 100

Złożoność

65 / 100

Czynniki ryzyka

No estimated value or budget disclosed. May affect feasibility of bidding.

Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...

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Wykorzystuje:

  • Description
  • Industries & Services
  • Capabilities
  • Market & Experience
  • Certifications

Przegląd

Moderate opportunity

Kluczowe fakty

  • Supplies contract
  • 1 lot
  • Duration 23 MONTH
  • Supply of 1 fully automated plasma etch system for 300 mm wafers (mainframe and process chambers).
  • System capable of high aspect ratio etching of silicon, SiO2, and SiN.
Pokaż pełne podsumowanie

Tender for a fully automated high aspect ratio plasma etch system for 300 mm wafers, to be delivered to Dresden, Germany. One lot. Negotiated procedure with call for competition. EU funded. Estimated value not disclosed. Deadline: 2026-07-15 09:30 (local time). Procurement documents available but not analyzed.

Ryzyka

No estimated value or budget disclosed. May affect feasibility of bidding.

Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...

Analiza może być niepełna

Przeanalizowano tylko część dokumentacji. Pozostałe dokumenty mogą zawierać dodatkowe wymagania, certyfikaty lub dokumenty do złożenia.

Kluczowe wymagania

Technical

  • System must be fully automated for plasma etching on 300 mm wafers.
  • Must achieve high aspect ratio patterning in silicon and related materials.

Certifications

  • Compliance with cleanroom class 1000 (ISO 6) environment.

Wymagania mogą być niepełne.

Kryteria udzielenia

Lot 1

Technical execution (55%) — 55%Binding delivery period (10%) — 10%Price (35%) — 35%

Zamawiający

Lokalizacja

München, DEU

Profil zamawiającego

Otwórz profil

Identyfikator

DE 129515865

Działalność

General public services

Części (1)

LOT-0000

System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

Supply of 1 unit of a fully automated plasma etch system for 300 mm wafers used for high aspect ratio etching of silicon and related materials (SiO2, SiN) in a cleanroom class 1000 environment. Includes optional items per technical specification. Duration: 23 months.

SuppliesEU fundedElectronic submission

Lokalizacja

Dresden, Germany

Czas trwania

23 MONTH

Kategoria

Special-purpose machinery

Kryteria udzielenia

Price

Termin

Expired Jul 15, 2026

Szczegóły zamówienia

Data publikacji
10 Jun 2026
Języki
German

Metadane referencyjne

Podstawa prawna
32014L0024

Identyfikatory referencyjne

ID przetargu
399697-2026

Dokumenty (2)

Dokument zamówienia 1Portal składania ofert 1

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