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System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

Fraunhofer-Gesellschaft - Einkauf B12·München, Germany·Deadline Jul 15, 2026 · 6 days left·Neg W Call·Supplies
Original notice title

Germany – Miscellaneous special-purpose machinery – System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

50/100

Opportunity Score

Needs reviewMedium complexity
SuppliesOpen
Why this score?

Opportunity

50 / 100

Complexity

60 / 100

Risk factors

No budget or estimated value disclosed; risk of mismatch between buyer's expectation and bidder's pricing.

Requirement for 'at least 3 comparable projects not older than three years' may be restrictive for newer entrants.

Submission deadline in 6 days

Deep Portfolio Analysis

Deep Company Fit Analysis

Uses:

  • Description
  • Industries & Services
  • Capabilities
  • Market & Experience
  • Certifications

Overview

Moderate opportunity

Key Facts

  • Supplies contract
  • 1 lot
  • Duration 23 MONTH
  • Supply and delivery of a high aspect ratio etch system (mainframe and process chambers)
  • Tool must be fully automated for 300mm wafer processing
Show full summary

Supply of a fully automated plasma etch system for high aspect ratio features on 300mm wafers, to be delivered to Fraunhofer in Dresden, Germany. The tender uses a negotiated procedure without prior publication (neg-w-call) and is partially funded by EU funds. The contract duration is 23 months. No estimated value is provided. Submission deadline: 15 July 2026, 11:30 (CET).

Risks

No budget or estimated value disclosed; risk of mismatch between buyer's expectation and bidder's pricing.

Requirement for 'at least 3 comparable projects not older than three years' may be restrictive for newer entrants.

Submission deadline in 6 days

Analysis may be incomplete

Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.

Key Requirements

Technical

  • Technical product/service features (55% weight)
  • Binding delivery period (10% weight)
  • Price (35% weight)

Award Criteria

Lot 1

tech. product/service features55%

Buyer

Name

Fraunhofer-Gesellschaft - Einkauf B12

Location

München, DEU

Buyer profile

Open profile

Identifier

DE 129515865

Activity

General public services

Lots (1)

LOT-0000

System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

1 piece of a fully automated plasma etch tool for 300mm wafers, cleanroom class 1000 (ISO Class 6) environment. Purpose: patterning of high aspect ratio features in silicon and related materials (SiO2, SiN). Optional items per technical specification.

SuppliesEU fundedElectronic submission

Location

Dresden, Germany

Duration

23 MONTH

Category

Special-purpose machinery

Selection criteria

Quality

Deadline

Deadline Jul 15, 2026

Procurement Details

Publication date
10 cze 2026
Notice type
Contract notice — standard
Languages
German

Reference metadata

Notice subtype
16
Notice version
1
Legal basis
32014L0024

Reference IDs

Tender ID
399697-2026

Documents (2)

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