Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Titre original de l'avis
Germany – Miscellaneous special-purpose machinery – Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Score d'opportunité
Pourquoi ce score ?
Opportunité
50 / 100
Complexité
60 / 100
Facteurs de risque
No estimated value is provided, making it difficult to assess budget alignment and competitiveness.
Procurement documents (e.g., full technical specifications, terms) were not analyzed. Critical details may be missing.
Analyse approfondie du portefeuille
Utilise:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Informations clés
- Pouvoir adjudicateur
- Fraunhofer-Gesellschaft, Einkauf B12
- Pays
- Allemagne
- CPV
- 42990000 - Miscellaneous special-purpose machinery
- Date limite
- Jul 24, 2026
Aperçu
Moderate opportunityFaits clés
- Supplies contract
- 1 lot
- Duration 12 MONTH
- Supply of 1 Die-to-Wafer Bonder
- Options: extended warranty (additional 12 months, total 24)
Afficher le résumé complet
Procurement of a Die-to-Wafer Bonder for Fraunhofer IPMS in Dresden, Germany. Open procedure, single lot, contract for supplies. EU-funded. Award criteria: quality 65%, price 35%. Tender deadline 24 July 2026.
Risques
No estimated value is provided, making it difficult to assess budget alignment and competitiveness.
Procurement documents (e.g., full technical specifications, terms) were not analyzed. Critical details may be missing.
L'analyse peut être incomplète
Seule une partie des documents de consultation a été analysée. Des exigences, certificats ou documents de soumission supplémentaires peuvent exister dans les documents restants.
Exigences clés
Technical
- SECS-GEM communication support
- Wafer size handling (source and target)
- Chiplet tray compatibility
Les exigences peuvent être incomplètes.
Critères d'attribution
Lot 1
Acheteur
Localisation
München, DEU
Site web
Profil acheteur
Identifiant
DE 129515865
Activité
General public services
Lots (1)
LOT-0000
Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Supply of 1 Die-to-Wafer Bonder. Options include extended warranty (24 months total), wafer size handling, chiplet tray support, and SECS-GEM communication with protocols E30, E5, E37, E10 or proprietary documented interface.
Localisation
Durée
Catégorie
Critères d'attribution
Date limite
Détails des critères
Technische Ausführung
Preis
Note sur la valeur
Afficher les données TED originales
Description TED originale
1 Piece -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1): The system can be controlled using SECS-GEM commands. The following protocols must be supported: E30, E5, E37 and E10. Alternatively, a proprietary but completely documented communication interface has to be provided.
Détails de la procédure
- Date de publication
- 24 Jun 2026
- Langues
- German
Métadonnées de référence
- Base juridique
- 32014L0024
Identifiants de référence
- ID de l'appel d'offres
- 434171-2026
Documents (2)
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Score d'opportunité
Pourquoi ce score ?
Opportunité
50 / 100
Complexité
60 / 100
Facteurs de risque
No estimated value is provided, making it difficult to assess budget alignment and competitiveness.
Procurement documents (e.g., full technical specifications, terms) were not analyzed. Critical details may be missing.
Analyse approfondie du portefeuille
Utilise:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications