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Ireland – Laboratory, optical and precision equipments (excl. glasses) – LA3215C-UCC-CFT for the Supply of a Suite of Plasma Etcher and Plasma Deposition Tools, 4 Lots

Education Procurement Service (EPS)Limerick, IrelandEUR 3,300,000 / ~EUR 3,300,00028 days leftopen
65

Opportunity Score

Confidence: 50%

Complexity: high

28 days

Deadline

supplies

Contract

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AI Analysis Summary

Moderate opportunity

Open tender by Education Procurement Service (EPS) for University College Cork (Tyndall National Institute) for supply, delivery, installation, and commissioning of a suite of plasma etching and deposition tools in 4 lots. The equipment will be used for semiconductor device fabrication, including silicon microelectronics, MEMS, photonics, and other materials. Estimated total value €3,300,000. Deadline for tenders: 2026-07-17 11:00 UTC. Submission via electronic means only, in English. Performance location: Ireland (IE052).

Strengths

Documents available

Open procedure

28 days left

Analysis may be incomplete

Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.

Key Requirements

  • Cutting-edge solutions for etching and deposition with precision, reliability, efficiency
  • Ability to handle both 100 mm and 200 mm wafers
  • Tenderers may submit for one or more lots (up to 4 lots)

Buyer

Name

Education Procurement Service (EPS)

Location

Limerick, IRL

Buyer profile

Open profile

Identifier

IE 6609370 G

Lots (4)

#LOT-0001Plasma Etcher ,Silicon ,Dielectrics

Advanced plasma etching system for etching polysilicon, silicon dioxide, and silicon nitride thin films using medium high-density plasma processes.

EUR 3,300,00038000000IRL
#LOT-0002Plasma Etcher ,Metals ,Piezoelectrics

Advanced plasma etching system for etching aluminium, molybdenum, and aluminium scandium nitride thin films using medium high-density plasma processes.

3,300,00038000000IRL
#LOT-0003Plasma Etcher ,Slow and Controllable Rate ,Atomic Layer Etch for Silicon , Dielectrics

Advanced plasma etching system capable of both conventional high-rate etching and slow, controllable atomic layer etching for silicon, silicon dioxide, and silicon nitride thin films.

3,300,00038000000IRL

Procurement Details

Publication

16 Jun 2026

Deadline

17 Jul 2026, 11:00

Procedure

open

Contract

supplies

Duration

48 MONTH

Language

ENG

Publication #

415187-2026

Classification

Laboratory, optical and precision equipments (excl. glasses)

Performance: Ireland

Documents (2)

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