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System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

Fraunhofer-Gesellschaft - Einkauf B12·München, Germany·Expired · Jul 15, 2026·Neg W Call·Supplies
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Germany – Miscellaneous special-purpose machinery – System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

55/100

Score d'opportunité

Needs reviewMedium complexity
SuppliesExpired
Pourquoi ce score ?

Opportunité

55 / 100

Complexité

65 / 100

Facteurs de risque

No estimated value or budget disclosed. May affect feasibility of bidding.

Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...

Analyse approfondie du portefeuille

Analyse approfondie de l'adéquation entreprise

Utilise:

  • Description
  • Industries & Services
  • Capabilities
  • Market & Experience
  • Certifications

Aperçu

Moderate opportunity

Faits clés

  • Supplies contract
  • 1 lot
  • Duration 23 MONTH
  • Supply of 1 fully automated plasma etch system for 300 mm wafers (mainframe and process chambers).
  • System capable of high aspect ratio etching of silicon, SiO2, and SiN.
Afficher le résumé complet

Tender for a fully automated high aspect ratio plasma etch system for 300 mm wafers, to be delivered to Dresden, Germany. One lot. Negotiated procedure with call for competition. EU funded. Estimated value not disclosed. Deadline: 2026-07-15 09:30 (local time). Procurement documents available but not analyzed.

Risques

No estimated value or budget disclosed. May affect feasibility of bidding.

Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...

L'analyse peut être incomplète

Seule une partie des documents de consultation a été analysée. Des exigences, certificats ou documents de soumission supplémentaires peuvent exister dans les documents restants.

Exigences clés

Technical

  • System must be fully automated for plasma etching on 300 mm wafers.
  • Must achieve high aspect ratio patterning in silicon and related materials.

Certifications

  • Compliance with cleanroom class 1000 (ISO 6) environment.

Les exigences peuvent être incomplètes.

Critères d'attribution

Lot 1

Technical execution (55%) — 55%Binding delivery period (10%) — 10%Price (35%) — 35%

Acheteur

Localisation

München, DEU

Profil acheteur

Ouvrir le profil

Identifiant

DE 129515865

Activité

General public services

Lots (1)

LOT-0000

System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P

Supply of 1 unit of a fully automated plasma etch system for 300 mm wafers used for high aspect ratio etching of silicon and related materials (SiO2, SiN) in a cleanroom class 1000 environment. Includes optional items per technical specification. Duration: 23 months.

SuppliesEU fundedElectronic submission

Localisation

Dresden, Germany

Durée

23 MONTH

Catégorie

Special-purpose machinery

Critères d'attribution

Price

Date limite

Expired Jul 15, 2026

Détails de la procédure

Date de publication
10 Jun 2026
Langues
German

Métadonnées de référence

Base juridique
32014L0024

Identifiants de référence

ID de l'appel d'offres
399697-2026

Documents (2)

Document de consultation 1Portail de soumission 1

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