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Kauf einer DRIE/ RIE-Anlage (Plasmaätzanlage)

Westsächsische Hochschule Zwickau·Zwickau, Germany·Expired · Jul 03, 2026·Open·Supplies
Structured notice only
Titre original de l'avis

Germany – Laboratory, optical and precision equipments (excl. glasses) – Kauf einer DRIE/ RIE-Anlage (Plasmaätzanlage)

50/100

Score d'opportunité

Needs reviewHigh complexity
SuppliesExpired
Pourquoi ce score ?

Opportunité

50 / 100

Complexité

85 / 100

Facteurs de risque

No estimated contract value or budget is provided, making it difficult to assess bid viability and competition level.

Very detailed and stringent technical specifications (etch rates, profile, endpoint detection, software standards) may...

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Aperçu

Moderate opportunity

Faits clés

  • Supplies contract
  • 1 lot
  • Duration 50 WEEK
  • Supply of a DRIE/RIE plasma etching system for 100mm and 150mm wafers
  • Bosch process capability with silicon removal rate up to 2.5 mm³/s
Afficher le résumé complet

Open tender by Westsächsische Hochschule Zwickau for a DRIE/RIE plasma etching system (including substrate electrode, edge protection, notching control, endpoint detection, software, installation, and training). Delivery to Zwickau, Germany, within 50 weeks. The tender appears to be for a single lot despite structured data showing three lots (likely a data extraction issue). Award criteria: 30% price, 60% fulfillment of performance parameters, 10% delivery time. Selection criteria require an application lab within 12 hours travel from Zwickau. No estimated value disclosed. Submission deadline 2026-07-10, electronic submission only, German language. Procurement documents not analyzed.

Risques

No estimated contract value or budget is provided, making it difficult to assess bid viability and competition level.

Very detailed and stringent technical specifications (etch rates, profile, endpoint detection, software standards) may...

L'analyse peut être incomplète

Seule une partie des documents de consultation a été analysée. Des exigences, certificats ou documents de soumission supplémentaires peuvent exister dans les documents restants.

Exigences clés

Technical

  • System must process 100mm and 150mm wafers (with/without flat, notch)
  • Silicon etch rate ≥10 µm/min in acceptance test
  • Sidewall deviation ≤10 µm from tangent

Les exigences peuvent être incomplètes.

Critères d'attribution

Lot 1

Preiskriterium30%Erfüllung der Leistungsparameter60%Lieferzeit10%

Acheteur

Localisation

Zwickau, DEU

Site web

www.whz.de

Profil acheteur

Ouvrir le profil

Identifiant

14-1215011WHZ01-34

Activité

Education

Lots (1)

LOT-0001

Kauf einer DRIE/ RIE-Anlage (Plasmaätzanlage)

Supply of a DRIE/RIE system for silicon deep etching and RIE of thin dielectrics, including all components (process chamber, ICP source, gas lines, pumps, etc.), electrostatic chuck, edge protection, notching control, endpoint detection (optical emission), software with SEMI E95 compliance, installation, and training. Acceptance test with specific etch rate and profile requirements. Delivery to Zwickau, max 50 weeks after order.

SuppliesEU fundedElectronic submission

Localisation

Zwickau, Germany

Durée

50 WEEK

Catégorie

Laboratory, optical and precision equipments

Critères d'attribution

Preiskriterium; Erfüllung der Leistungsparameter; Lieferzeit

Date limite

Expired Jul 10, 2026

Détails de la procédure

Date de publication
04 Jun 2026
Langues
German

Métadonnées de référence

Base juridique
32014L0024

Identifiants de référence

ID de l'appel d'offres
388383-2026

Documents (2)

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