Deep Reaction Ion Etcher
Original notice title
Sweden – Industrial machinery – Deep Reaction Ion Etcher (DRIE)
Opportunity Score
Why this score?
Opportunity
0 / 100
Complexity
0 / 100
Risk factors
Submission deadline in 13 days
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Tender facts
- Contracting authority
- Uppsala universitet
- Country
- Sweden
- CPV
- 42000000 - Industrial machinery
- Deadline
- Nov 16, 2026
- Estimated value
- SEK 1 (approx. EUR 0)
AI tender analysis
Tenderwize prepares an AI analysis of this tender based on the TED notice and procurement documents: scope of work, key requirements, eligibility criteria, risks and questions for the buyer. The analysis is generated when the tender is opened.
Buyer
Location
Uppsala, SWE
Website
Buyer profile
Identifier
202100-2932
Activity
Education
Lots (1)
LOT-0001
Deep Reaction Ion Etcher (DRIE)
Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.
EUR 0
Estimated value
Location
Duration
Category
Award details
Myfab Uppsala aims at purchasing a Deep Reaction Ion Etcher (DRIE). The purpose of the tool is to transfer patterns defined by e.g., photo- and electron beam lithography covering the pattens size range from all substrate range down to a few nanometres. The system will be used by many operators in a university laboratory environment. It must be easy to use and be insensitive to frequent change of process between batches. The processes include broad range of etching capability: low to high etch rate, wafer dicing, high uniformity, high open area, high aspect ratio, and nanometre scale. The system is intended for etching of silicon as well as other materials compatible with silicon etching, with both photoresist resins and hard masks for patterning.
Procurement Details
- Publication date
- 02 Nov 2026
- Languages
- English
Reference metadata
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 763694-2026
Documents (1)
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Opportunity Score
Why this score?
Opportunity
0 / 100
Complexity
0 / 100
Risk factors
Submission deadline in 13 days
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications