Automated 300 mm Die-to-Wafer Bonding Tool
Original notice title
Germany – Microelectronic machinery and apparatus and microsystems – Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Opportunity Score
Why this score?
Opportunity
0 / 100
Complexity
0 / 100
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Tender facts
- Contracting authority
- Fraunhofer-Gesellschaft - Einkauf B12
- Country
- Germany
- CPV
- 31712000 - Microelectronic machinery and apparatus and microsystems
- Deadline
- Dec 02, 2026
AI tender analysis
Tenderwize prepares an AI analysis of this tender based on the TED notice and procurement documents: scope of work, key requirements, eligibility criteria, risks and questions for the buyer. The analysis is generated when the tender is opened.
Award Criteria
Lot 1
Buyer
Location
München, DEU
Website
Buyer profile
Identifier
DE 129515865
Activity
General public services
Lots (1)
LOT-0000
Automated 300 mm Die-to-Wafer thermocompression bonding tool - PR1275392-3460-W
Automated 300 mm Die-to-Wafer thermocompression bonding tool
Location
Duration
Category
Award Criteria
Award details
technische Ausführung
Preis
Procurement Details
- Publication date
- 01 Nov 2026
- Languages
- German
Reference metadata
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 756518-2026
Documents (2)
Similar tenders
Opportunity Score
Why this score?
Opportunity
0 / 100
Complexity
0 / 100
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications