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Die-to-wafer bonder (IPMS-MRS14.1)

Fraunhofer-Gesellschaft - Einkauf B12·München, Germany·Deadline Jul 24, 2026 · 17 days left·Open·Supplies
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Original notice title

Germany – Miscellaneous special-purpose machinery – Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P

0/100

Opportunity Score

High riskLow complexity
SuppliesOpen
Why this score?

Opportunity

0 / 100

Complexity

0 / 100

Deep Portfolio Analysis

Deep Company Fit Analysis

Uses:

  • Description
  • Industries & Services
  • Capabilities
  • Market & Experience
  • Certifications

Award Criteria

Lot 1

technical Aspects — 65%

Buyer

Name

Fraunhofer-Gesellschaft - Einkauf B12

Location

München, DEU

Buyer profile

Open profile

Identifier

DE 129515865

Activity

General public services

Lots (1)

LOT-0000

Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P

1 Piece -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1): The system can be controlled using SECS-GEM commands. The following protocols must be supported: E30, E5, E37 and E10. Alternatively, a proprietary but completely documented communication interface has to be provided.

SuppliesEU fundedElectronic submission

Location

Dresden, Germany

Duration

12 MONTH

Category

Special-purpose machinery

Selection criteria

Quality

Procurement Details

Publication date
24 Jun 2026
Notice type
Contract notice — standard
Languages
German

Reference metadata

Notice subtype
16
Notice version
1
Legal basis
32014L0024

Reference IDs

Tender ID
434171-2026

Documents (2)

Procurement document 1Submission portal 1

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