Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Original notice title
Germany – Miscellaneous special-purpose machinery – Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Opportunity Score
Why this score?
Opportunity
50 / 100
Complexity
60 / 100
Risk factors
No estimated value is provided, making it difficult to assess budget alignment and competitiveness.
Procurement documents (e.g., full technical specifications, terms) were not analyzed. Critical details may be missing.
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Overview
Moderate opportunityKey Facts
- Supplies contract
- 1 lot
- Duration 12 MONTH
- Supply of 1 Die-to-Wafer Bonder
- Options: extended warranty (additional 12 months, total 24)
Show full summary
Procurement of a Die-to-Wafer Bonder for Fraunhofer IPMS in Dresden, Germany. Open procedure, single lot, contract for supplies. EU-funded. Award criteria: quality 65%, price 35%. Tender deadline 24 July 2026.
Risks
No estimated value is provided, making it difficult to assess budget alignment and competitiveness.
Procurement documents (e.g., full technical specifications, terms) were not analyzed. Critical details may be missing.
Analysis may be incomplete
Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.
Key Requirements
Technical
- SECS-GEM communication support
- Wafer size handling (source and target)
- Chiplet tray compatibility
Requirements may be incomplete.
Award Criteria
Lot 1
Buyer
Location
München, DEU
Website
Buyer profile
Identifier
DE 129515865
Activity
General public services
Lots (1)
LOT-0000
Die-to-Wafer Bonder (IPMS-MRS14.1) - PR922727-2480-P
Supply of 1 Die-to-Wafer Bonder. Options include extended warranty (24 months total), wafer size handling, chiplet tray support, and SECS-GEM communication with protocols E30, E5, E37, E10 or proprietary documented interface.
Location
Duration
Category
Award Criteria
Deadline
Award details
Technische Ausführung
Preis
Value note
Show original TED data
Original TED description
1 Piece -Die-to-Wafer Bonder (IPMS-MRS14.1) Option 1 (LV Pos. 1.13): Please offer an extended warranty of further 12 months (in total 24 month) Option 2 (LV Pos. 3.6): The tool should handle wafers with the size of (source and target) Option 3 (LV Pos. 3.14): The chiplets can be picked from this type of tray (source) Option 4 (LV Pos. 4.1): The system can be controlled using SECS-GEM commands. The following protocols must be supported: E30, E5, E37 and E10. Alternatively, a proprietary but completely documented communication interface has to be provided.
Procurement Details
- Publication date
- 24 Jun 2026
- Languages
- German
Reference metadata
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 434171-2026
Documents (2)
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Opportunity Score
Why this score?
Opportunity
50 / 100
Complexity
60 / 100
Risk factors
No estimated value is provided, making it difficult to assess budget alignment and competitiveness.
Procurement documents (e.g., full technical specifications, terms) were not analyzed. Critical details may be missing.
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications