Semi-automatic RF probe system up to 250 GHz
Original notice title
Germany – Instruments for measuring electrical quantities – 200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz
Opportunity Score
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Opportunity
0 / 100
Complexity
0 / 100
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Tender facts
- Contracting authority
- IHP GmbH - Leibniz-Institut für innovative Mikroelektronik
- Country
- Germany
- CPV
- 38341300 - Instruments for measuring electrical quantities +1 more
- Deadline
- Jul 16, 2026
AI tender analysis
Tenderwize prepares an AI analysis of this tender based on the TED notice and procurement documents: scope of work, key requirements, eligibility criteria, risks and questions for the buyer. The analysis is generated when the tender is opened.
Buyer
Location
Frankfurt (Oder), DEU
Identifier
DE138996546
Activity
General public services
Lots (1)
LOT-0001
200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz
- Semi-automated 200 mm probe system for on-wafer measurements - Integrated controlled dry atmosphere to prevent condensation and ice formation during measurements below ambient temperature - System design with a defined interface architecture enabling integration of optional thermal chucks through standardized mechanical, electrical, and software interfaces - Automatic wafer size recognition (150 mm, 200 mm wafers and individual dies down to 5 × 5 mm) - Precision XY stage: minimum travel range 310 × 310 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Precision Z stage: minimum travel range 30 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Theta axis: ±5°, resolution ? 0.0001° - Controlled contact mechanism with repeatability ? 1 µm - Integrated vibration isolation and leveling table - Central operator console for control of all axes and system functions - Integrated keyboard and mouse tray - Power supply: 100-240 V AC, 50/60 Hz
Location
Category
Award details
- Semi-automated 200 mm probe system for on-wafer measurements - Integrated controlled dry atmosphere to prevent condensation and ice formation during measurements below ambient temperature - System design with a defined interface architecture enabling integration of optional thermal chucks through standardized mechanical, electrical, and software interfaces - Automatic wafer size recognition (150 mm, 200 mm wafers and individual dies down to 5 × 5 mm) - Precision XY stage: minimum travel range 310 × 310 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Precision Z stage: minimum travel range 30 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Theta axis: ±5°, resolution ? 0.0001° - Controlled contact mechanism with repeatability ? 1 µm - Integrated vibration isolation and leveling table - Central operator console for control of all axes and system functions - Integrated keyboard and mouse tray - Power supply: 100-240 V AC, 50/60 Hz
Additional CPV codes
Procurement Details
- Publication date
- 24 Jun 2026
- Languages
- German
Reference metadata
- Legal basis
- 32014L0024
Reference IDs
- Tender ID
- 432100-2026
Documents (2)
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Opportunity Score
Why this score?
Opportunity
0 / 100
Complexity
0 / 100
Deep Portfolio Analysis
Uses:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications