Awarded contractNeg W CallSuppliesGermany
Wafer Bonder for oxidfree bonding process - PR941467-3340-P (ENAS-05)
1 supplier awarded•1 lot awarded
Buyer: Fraunhofer-Gesellschaft - Einkauf B12 / München, Germany
Published Jul 12, 2026Awarded Jul 09, 2026
Microelectronic machinery and apparatus
Awarded value
Not specified
Estimated value
Not specified
Award date
Jul 09, 2026
Winners
1
Lots awarded
1
Winners
EV Group E. Thallner GmbH
1 lotNeuhaus am Inn, DEU
Not specified This contract
6 award notices•6 awarded lots•-€1 total
Lots awarded
| Lot | Title | Winner | Award value | Main CPV |
|---|---|---|---|---|
| LOT-0000 | EV Group E. Thallner GmbH | — | Microelectronic machinery and apparatus (31712100) |