Semi-automatic RF probe system up to 250 GHz
Originaltitel der Bekanntmachung
Germany – Instruments for measuring electrical quantities – 200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz
Opportunity Score
Warum diese Bewertung?
Chance
0 / 100
Komplexität
0 / 100
Tiefe Portfolioanalyse
Verwendet:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Eckdaten der Ausschreibung
- Öffentlicher Auftraggeber
- IHP GmbH - Leibniz-Institut für innovative Mikroelektronik
- Land
- Deutschland
- CPV
- 38341300 - Instruments for measuring electrical quantities +1 weitere
- Frist
- Jul 16, 2026
KI-Analyse der Ausschreibung
Tenderwize erstellt auf Basis der TED-Bekanntmachung und der Vergabeunterlagen eine KI-Analyse dieser Ausschreibung: Leistungsumfang, zentrale Anforderungen, Eignungskriterien, Risiken und Fragen an den Auftraggeber. Die Analyse wird beim Öffnen der Ausschreibung erstellt.
Auftraggeber
Ort
Frankfurt (Oder), DEU
Kennung
DE138996546
Tätigkeit
General public services
Lose (1)
LOT-0001
200 mm Semi-Automatic RF Probe System for On-Wafer Measurements up to 250 GHz
- Semi-automated 200 mm probe system for on-wafer measurements - Integrated controlled dry atmosphere to prevent condensation and ice formation during measurements below ambient temperature - System design with a defined interface architecture enabling integration of optional thermal chucks through standardized mechanical, electrical, and software interfaces - Automatic wafer size recognition (150 mm, 200 mm wafers and individual dies down to 5 × 5 mm) - Precision XY stage: minimum travel range 310 × 310 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Precision Z stage: minimum travel range 30 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Theta axis: ±5°, resolution ? 0.0001° - Controlled contact mechanism with repeatability ? 1 µm - Integrated vibration isolation and leveling table - Central operator console for control of all axes and system functions - Integrated keyboard and mouse tray - Power supply: 100-240 V AC, 50/60 Hz
Ort
Kategorie
Zuschlagsdetails
- Semi-automated 200 mm probe system for on-wafer measurements - Integrated controlled dry atmosphere to prevent condensation and ice formation during measurements below ambient temperature - System design with a defined interface architecture enabling integration of optional thermal chucks through standardized mechanical, electrical, and software interfaces - Automatic wafer size recognition (150 mm, 200 mm wafers and individual dies down to 5 × 5 mm) - Precision XY stage: minimum travel range 310 × 310 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Precision Z stage: minimum travel range 30 mm, repeatability < 1.0 µm, accuracy < 2.0 µm - Theta axis: ±5°, resolution ? 0.0001° - Controlled contact mechanism with repeatability ? 1 µm - Integrated vibration isolation and leveling table - Central operator console for control of all axes and system functions - Integrated keyboard and mouse tray - Power supply: 100-240 V AC, 50/60 Hz
Zusätzliche CPV-Codes
Vergabedetails
- Veröffentlichungsdatum
- 24 Jun 2026
- Sprachen
- German
Referenzmetadaten
- Rechtsgrundlage
- 32014L0024
Referenz-IDs
- Ausschreibungs-ID
- 432100-2026
Dokumente (2)
Ähnliche Ausschreibungen
Opportunity Score
Warum diese Bewertung?
Chance
0 / 100
Komplexität
0 / 100
Tiefe Portfolioanalyse
Verwendet:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications