System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Originaltitel der Bekanntmachung
Germany – Miscellaneous special-purpose machinery – System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Opportunity Score
Warum diese Bewertung?
Chance
55 / 100
Komplexität
65 / 100
Risikofaktoren
No estimated value or budget disclosed. May affect feasibility of bidding.
Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...
Tiefe Portfolioanalyse
Verwendet:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications
Überblick
Moderate opportunityWichtige Fakten
- Supplies contract
- 1 lot
- Duration 23 MONTH
- Supply of 1 fully automated plasma etch system for 300 mm wafers (mainframe and process chambers).
- System capable of high aspect ratio etching of silicon, SiO2, and SiN.
Vollständige Zusammenfassung anzeigen
Tender for a fully automated high aspect ratio plasma etch system for 300 mm wafers, to be delivered to Dresden, Germany. One lot. Negotiated procedure with call for competition. EU funded. Estimated value not disclosed. Deadline: 2026-07-15 09:30 (local time). Procurement documents available but not analyzed.
Risiken
No estimated value or budget disclosed. May affect feasibility of bidding.
Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...
Analyse kann unvollständig sein
Nur ein Teil der Vergabeunterlagen wurde analysiert. Weitere Anforderungen, Zertifikate oder Einreichungsdokumente können in den übrigen Unterlagen enthalten sein.
Wichtige Anforderungen
Technical
- System must be fully automated for plasma etching on 300 mm wafers.
- Must achieve high aspect ratio patterning in silicon and related materials.
Certifications
- Compliance with cleanroom class 1000 (ISO 6) environment.
Anforderungen können unvollständig sein.
Zuschlagskriterien
Lot 1
Auftraggeber
Ort
München, DEU
Website
Auftraggeberprofil
Kennung
DE 129515865
Tätigkeit
General public services
Lose (1)
LOT-0000
System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) - PR1153448-2480-P
Supply of 1 unit of a fully automated plasma etch system for 300 mm wafers used for high aspect ratio etching of silicon and related materials (SiO2, SiN) in a cleanroom class 1000 environment. Includes optional items per technical specification. Duration: 23 months.
Ort
Dauer
Kategorie
Zuschlagskriterien
Frist
Zuschlagsdetails
Technische Ausführung
Verbindliche Lieferzeit
Preis
Hinweis zum Wert
Originale TED-Daten anzeigen
Originale TED-Beschreibung
1 Piece: System for High Apect Ratio Etch consisting of mainframe and process chambers (IPMS-CNT05.1) A fully automated process tool to be used for plasma etch processes on wafers with a diameter of 300 mm. The systems will be used for the processing of Silicon CMOS wafers in a cleanroom class 1000 (approximately class 6 EN ISO 14644-1) production environment. The new tool shall be used for patterning of high aspect ratio features in silicon as well as all related needed materials (e.g. SiO2, SiN) to reach this main target. Optional items according to Technical Tender Specification.
Vergabedetails
- Veröffentlichungsdatum
- 10 Jun 2026
- Sprachen
- German
Referenzmetadaten
- Rechtsgrundlage
- 32014L0024
Referenz-IDs
- Ausschreibungs-ID
- 399697-2026
Dokumente (2)
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Opportunity Score
Warum diese Bewertung?
Chance
55 / 100
Komplexität
65 / 100
Risikofaktoren
No estimated value or budget disclosed. May affect feasibility of bidding.
Approximately 35 days from publication (10 June 2026) to deadline (15 July 2026). Tight for a technical equipment tende...
Tiefe Portfolioanalyse
Verwendet:
- Description
- Industries & Services
- Capabilities
- Market & Experience
- Certifications