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Germany – Miscellaneous general and special-purpose machinery – CMP-System 100/150‑mm‑Wafer (IAF-03) - PR1199438-2050-P

Fraunhofer-Gesellschaft - Einkauf B12München, GermanyNot disclosed4 days leftopen
50

Opportunity Score

Confidence: 55%

Complexity: medium

4 days

Deadline

supplies

Contract

SME suitable

Deep Portfolio Analysis

  • Company fit score
  • Missing certificates
  • Eligibility blockers
  • Bid / No-Bid recommendation
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AI Analysis Summary

Moderate opportunity

This tender by Fraunhofer-Gesellschaft is for a CMP system (chemical-mechanical polishing) for 100/150 mm wafers, including integrated cleaning and optical endpoint detection. The contract is for supplies, to be performed in Freiburg, Germany. The deadline for submissions is June 19, 2026. No estimated value is provided. Award criteria are 65% technical specification and 35% price. Eligibility requires references, company profile, self-declarations, and revenue information. The structured data contains an incomplete second lot entry, which may be an error.

Strengths

Documents available

Open procedure

Medium complexity

Risks

Submission deadline in 4 days

Analysis may be incomplete

Only part of the procurement documentation was analyzed. Additional eligibility requirements, certificates, or submission documents may exist in the remaining tender documentation.

Key Requirements

  • Tender must be for a CMP system model with integrated wafer cleaning and optical thickness measurement
  • At least three references from the last three years for the offered model
  • Submission in German or English (two lots, one per language)

Award Criteria

Technical specification

Technical specification

Type: Quality

Buyer

Name

Fraunhofer-Gesellschaft - Einkauf B12

Location

München, DEU

Buyer profile

Open profile

Identifier

DE 129515865

Lots (2)

#LOT-0000CMP-System 100/150‑mm‑Wafer (IAF-03) - PR1199438-2050-P

Supply of one CMP system for chemical-mechanical polishing of dielectric layers on 100 mm and 150 mm Si and III-V semiconductor wafers, with integrated cleaning and optical endpoint detection. Includes three optional features: separate drainage lines, SECS/GEM interface, and torque EPD.

42900000DEU

Incomplete lot data. Only submission languages (ENG) and award criteria (price) are provided. This may represent an alternative language option for the same lot, but structured data extraction is incomplete.

Procurement Details

Publication

19 May 2026

Deadline

19 Jun 2026, 07:00

Procedure

open

Contract

supplies

Duration

7 MONTH

Language

DEU, ENG

Publication #

344230-2026

Classification

Performance: Germany

Documents (2)

CMP-System für 100/150-mm-Wafer Tender in Germany | TED 344230-2026